3d fem Search Results


3d fe nonlinear analysis  (ANSYS inc)
90
ANSYS inc 3d fe nonlinear analysis
3d Fe Nonlinear Analysis, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/10__1177_slash_0954406215571462-93-14-8?v=ANSYS+inc
Average 90 stars, based on 1 article reviews
3d fe nonlinear analysis - by Bioz Stars, 2026-07
90/100 stars
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3d semi-empirical fem model comsol multiphysics v 6.0  (COMSOL Inc)
90
COMSOL Inc 3d semi-empirical fem model comsol multiphysics v 6.0
3d Semi Empirical Fem Model Comsol Multiphysics V 6.0, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/10__1016_slash_j__mssp__2024__108563-61-25-33?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
3d semi-empirical fem model comsol multiphysics v 6.0 - by Bioz Stars, 2026-07
90/100 stars
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3d fem coupled thermal and electrical module  (COMSOL Inc)
90
COMSOL Inc 3d fem coupled thermal and electrical module
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
3d Fem Coupled Thermal And Electrical Module, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/pmc05923549-79-29-23?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
3d fem coupled thermal and electrical module - by Bioz Stars, 2026-07
90/100 stars
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temperature of the movement of the outer end of the screw comsol5.6  (COMSOL Inc)
90
COMSOL Inc temperature of the movement of the outer end of the screw comsol5.6
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
Temperature Of The Movement Of The Outer End Of The Screw Comsol5.6, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/pmc11487179-364-15-17?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
temperature of the movement of the outer end of the screw comsol5.6 - by Bioz Stars, 2026-07
90/100 stars
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fem software package ansys maxwell 3d  (ANSYS inc)
90
ANSYS inc fem software package ansys maxwell 3d
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
Fem Software Package Ansys Maxwell 3d, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/bio_rxiv__2020__02__09__941021-187-7-12?v=ANSYS+inc
Average 90 stars, based on 1 article reviews
fem software package ansys maxwell 3d - by Bioz Stars, 2026-07
90/100 stars
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3-d finite element model (fem) of a pc12 cell in the chamber  (COMSOL Inc)
90
COMSOL Inc 3-d finite element model (fem) of a pc12 cell in the chamber
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
3 D Finite Element Model (Fem) Of A Pc12 Cell In The Chamber, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/10__1109_slash_jmems__2008__921726-174-16-20?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
3-d finite element model (fem) of a pc12 cell in the chamber - by Bioz Stars, 2026-07
90/100 stars
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three-dimensional fem simulations  (COMSOL Inc)
90
COMSOL Inc three-dimensional fem simulations
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
Three Dimensional Fem Simulations, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/10__1088_slash_1361___6463_slash_aaa0e4-21-10-15?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
three-dimensional fem simulations - by Bioz Stars, 2026-07
90/100 stars
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3d-fem model  (ANSYS inc)
90
ANSYS inc 3d-fem model
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
3d Fem Model, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/10__3390_slash_en12122423-653-1-11?v=ANSYS+inc
Average 90 stars, based on 1 article reviews
3d-fem model - by Bioz Stars, 2026-07
90/100 stars
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3d magnetostatic fem simulations  (COMSOL Inc)
90
COMSOL Inc 3d magnetostatic fem simulations
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
3d Magnetostatic Fem Simulations, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/us09247630-165-0-20?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
3d magnetostatic fem simulations - by Bioz Stars, 2026-07
90/100 stars
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fem 3d  (COMSOL Inc)
90
COMSOL Inc fem 3d
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
Fem 3d, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/pmc09698283-157-5-10?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
fem 3d - by Bioz Stars, 2026-07
90/100 stars
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3d fem  (ANSYS inc)
90
ANSYS inc 3d fem
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
3d Fem, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/pmc12043224-116-5-10?v=ANSYS+inc
Average 90 stars, based on 1 article reviews
3d fem - by Bioz Stars, 2026-07
90/100 stars
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3d-fem model of the hollow composite disc with multiple holes  (ANSYS inc)
90
ANSYS inc 3d-fem model of the hollow composite disc with multiple holes
FEM simulation on Platform b ; <t>electrical</t> energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).
3d Fem Model Of The Hollow Composite Disc With Multiple Holes, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3d+fem/10__1177_slash_096369351402300401-104-12-17?v=ANSYS+inc
Average 90 stars, based on 1 article reviews
3d-fem model of the hollow composite disc with multiple holes - by Bioz Stars, 2026-07
90/100 stars
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Image Search Results


FEM simulation on Platform b ; electrical energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).

Journal: Nanomaterials

Article Title: The Effect of the MEMS Measurement Platform Design on the Seebeck Coefficient Measurement of a Single Nanowire

doi: 10.3390/nano8040219

Figure Lengend Snippet: FEM simulation on Platform b ; electrical energy dissipation in the heater structure causes the subsequent heat increase at one side of the gap. ( a ) The heat distribution across the bond pad. The inset shows the isothermal contour of the temperature distribution over the platform. ( b ) x y view of the simulated chip. Getting farther from the heater, the bond pads are more intact (compare the red and grey lines in both diagrams in (a) and (b)).

Article Snippet: To investigate the probability of such a heat distribution over the bond pads, the heat performance of TNCP b is simulated using a COMSOL 3D FEM coupled thermal and electrical module.

Techniques:

Ag nanowire electrical characterization using TNCP b . ( a ) I-V curve of the Ag nanowire at T = 297 K. The linear trend shows an ohmic contact. ( b ) Ag nanowire electrical conductivity. The conductivity decrease versus the temperature increase is a typical behavior of metals.

Journal: Nanomaterials

Article Title: The Effect of the MEMS Measurement Platform Design on the Seebeck Coefficient Measurement of a Single Nanowire

doi: 10.3390/nano8040219

Figure Lengend Snippet: Ag nanowire electrical characterization using TNCP b . ( a ) I-V curve of the Ag nanowire at T = 297 K. The linear trend shows an ohmic contact. ( b ) Ag nanowire electrical conductivity. The conductivity decrease versus the temperature increase is a typical behavior of metals.

Article Snippet: To investigate the probability of such a heat distribution over the bond pads, the heat performance of TNCP b is simulated using a COMSOL 3D FEM coupled thermal and electrical module.

Techniques: